U.S. Patent No. 5,400,904 C1
JEDEC Outline BGA Matrix Trays are available for many BGA package
sizes, and are available in various Temperature and Antistatic Range Materials.
As the electronics industry has advanced the art of semiconductor packaging, R.H. Murphy Co.
has responded with an innovative matrix tray design for today's generation of Ball Grid Array (BGA)
packages. Our BGA trays offer a unique mix of protection and flexibility for your automated environment.
So unique, they're patented!
Our innovative 'Flippable' Tray Design is recognized around the world. The
United States Patent and Trademark Office
granted a Patent in 1995 and issued Reexamination Certificate No. 5,400,904 C1 in 2001.
Worldwide Patents issued include Japan No. 2,852,872, Korea No. 166,983, Malaysia No. MY-112372-A, Philippine No. 1-1994-48864,
Singapore No. 69064, Taiwan No. 070,913, and U.K. No. 2,282,798. Other worldwide patents are pending.
Flip feature adds versatility
Our patented tray design enable packages to be handled 'solder balls up' and 'solder balls down', for pick-and-place
operations and automatic inspection of solder balls.
Built-in package protection
When housed in trays using our patented design, each package remains below the outside rail of the tray -
whether it's in the up or down position. The empty tray, when placed over a loaded tray to cover
the devices in place, will not contact the solder balls, even if the trays are misaligned.
Device orientation is exact and consistent
Our patented interengaging pocket design insures positive x-y retention of each package in both the
up or down positions. Either way, the package sits squarely in the pocket. Other trays set the
package on a pedestal, capturing half of the body height, or the angled sidewalls of the plastic
body. Moving the tray even slightly can easily dislodge the package from its inspection position.
Precision-engineered for pick-and-place operations
Tray pocket design and tolerances are optimized for pick-and-place equipment. Lead-in chamfers exist on
both sides of the tray, insuring the package 'bottoms out' in the pocket during auto insertion.
We use the right materials for the job
At R.H. Murphy Co., we know just how crucial selecting the right material is. High temperature
burn-in trays are made from PES with carbon fiber. Our low cost shipping trays are antistatic
coated. Mid range trays are also available. All materials reflect our 'no compromise' approach
to quality, ensuring consistent performance and longevity.
Standard-compliant design
Where appropriate, our BGA Trays incorporate JEDEC Standards to
ensure smooth operations in automated environments. In today's world of precision-oriented manufacturing,
tray products from R.H. Murphy Co. are part of the solution, not part of the problem.
Custom programs available
R.H. Murphy Co.'s design team is ready to take on the most demanding challenges of your unique
product requirements. If you need a custom tray design, consult us. We have the answers.
R.H. Murphy Co., Inc.: Innovation since 1982
When it comes to plastic application engineering, injection-molded trays, and semiconductor
carriers, R.H. Murphy Co. has the ideas that are right for the times. And when there's a better,
safer, more efficient way to provide plastics-related semiconductor solutions, you can count on
R.H. Murphy Co. to make it happen.
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