JEDEC Outline Ball Grid Array (BGA) Matrix Trays with our Patented Pocket Design Offer the Ultimate Protection and Convenience.

Flippable JEDEC BGA Matrix Trays
Flipped BGA Matrix Tray with balls up

Assorted JEDEC BGA Matrix Trays










JEDEC Matrix Trays for glob top BGA

Trays are available for many BGA package sizes and are available in various Temperature Range materials including NoStat® ESD-safe Materials.

Our BGA trays offer a unique mix of protection and flexibility for your automated environment.

Flip feature adds versatility with built-in package protection

Our patented tray designs enable packages to be handled 'solder balls up' and 'solder balls down', for pick-and-place operations and automatic inspection of solder balls. When housed in trays using our patented design, each package remains below the outside rail of the tray - whether it's in the up or down position. The empty tray, when placed over a loaded tray to cover the devices, will not contact the solder balls, even if the trays are misaligned.

Device orientation is exact and consistent

Our patented interengaging pocket design insures positive x-y retention of each package in both the up or down positions. Either way, the package sits squarely and securely in the pocket.



Some of the existing R H Murphy BGA Tray sizes

BGA Size

No. of Pockets

17 x 17mm


22 x 14mm


27 x 27mm


35 x 35mm


37.5 x 37.5mm


40 x 40mm


42.5 x 42.5 mm



Don’t see what you need? Please contact us – we may have other options or suggest a solution from our RapidTray® program.

More JEDEC Trays

Ball Grid Array JEDEC Matrix Trays
BGA JEDEC Matrix Trays
Trays in assorted configurations and colors
Custom JEDEC Matrix Trays
JEDEC PGA Matrix Trays and spacers
PGA JEDEC Matrix Trays
QFP Matrix Trays
RapidTray® Machined JEDEC Tray for unformed QFP with tie bar
RapidTray® Machined JEDEC Matrix Trays
How can we help?
Have questions on RH Murphy's capabilities? Need a quote? Or do you just want more information? Contact us and we'll be in touch shortly.

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