Automation

FLIPPABLE TRAYS ADD A NEW DIMENSION TO HANDLING AND PROTECTION

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THINKING 3-D WILL HAVE YOU FLIPPING

     Thanks to the wonder of gravity, you can rely on stuff staying in a box when placed there.  And if the stuff fits well in the box, only the top is accessible.  It’s pretty much the same for components in a tray.  Parts that fit precisely in tray pockets make processing a two dimensional activity unless you have discovered flipping.

    When BGAs (Ball Grid Array packages) first hit the market the need for accessing the balls was not recognized.  Once it was recognized, R H Murphy Company responded quickly with “flippable” trays.  R H Murphy invented BGA trays that can be inverted, unloaded, reloaded, and restacked while the parts remain contained and protected.  This makes inspection, rework, repair, even some level of testing possible without removing parts from the trays.  This same principal is readily applied to other device types.

   There is more to having flippable trays than just putting pockets on the bottom of a tray.  Managing the alignment and exposure of the parts in both orientations is critical.  Insuring that trays being stacked pre-align before engaging the parts requires unique features.  Eliminating device terminals, leads, or pins from being the point of first contact means the difference between a tray the protects and one the damages parts.

   The key to successful flipping is interengagement.  By building features that overlap, trays capture the components from the top and bottom simultaneously.  This provides a secure hand-off between trays and the components remain contained and protected in all orientations.

   R H Murphy has been doing all this while giving you the performance you count on:  ESD protection, mechanical integrity, thermal stability, JEDEC alignment features, and value above all else.  Don’t let yourself be limited to a two dimensional process.  Add a third dimension with flippable matrix trays from R H Murphy Company.

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Flippable BGA JEDEC Matrix Trays

CUSTOM FITS INCREASE PERFORMANCE AND SAVE MONEY - A CASE AGAINST STANDARDS

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A Case Against Standards: Interface components need real specifications

 

   JEDEC, the Joint Electron Design Engineering Council, originally started in 1958 as a division of the Electronic Industries Association and became an independent association, JEDEC Solid State Technology Association, in 1999.

   Since many of the standards developed by JEDEC cover devices from many manufacturers, the "standard" dimensions are too general to be used as specifications. In most instances, the JEDEC standards have been developed to create interchangeability among multiple sources of the same component type.  This has worked pretty well for PCB manufacturing because variation of the mounting footprints have been kept to a minimum.

    But before the assembly to the PCB takes place, most processing is done with the goal of not contacting the terminals/leads.  This goal makes it necessary to support the component by its body and here’s where it gets problematic.  There are many variations in material, assembly technology, and tooling for the body.  Rather than exclude any designs, the standards typically use reference dimensions or large tolerances for body dimensions.

     When trying to build “standard” interface components and tooling for a standardized component, building to accept the full range of the standard specification will not work. Build for the biggest parts and the small ones will be too loose.  Build for the smallest and the big ones get crunched.

     In the following example from JEDEC Registration MO-082 for .025”pitch ceramic quad flat packs (CQFP), the body dimensions are allowed to vary by 1mm while the formed leads may start to bend at 0.64mm.  Features accepting the largest body size will make contact with the leads of devices whose body dimensions are in the middle or lower range of the specification.

 

 

    The good news is that most components produced by a specific set of tooling have much less size variation than allowed by the specification.  That means that manufacturers can usually provide component specifications that are precise enough for safe handling without damage.  When good dimensions are not available, measuring a sample is a good alternative.

     The moral of the story is that it’s best to get manufacturers’ specifications for components rather than working with standards.  Be wary of handling material that claims to be for “standard” packages, particularly when working with delicate SMT devices like QFPs, BGAs, and CGAs.

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JEDEC and ANSI standards are no substitute for measurments

OLD SCHOOL PROTOTYPING - SOMETIMES NEWER ISN'T BETTER!

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     “3D printing” and “rapid prototypying” seem to be in every other headline we read today.  I know this is an exaggeration but the number of companies offering services or equipment is growing enormously with Forbes reporting the compound annual growth rate over the last 3 years for equipment manufacturers to be 33.8% (Forbes 6/30/2015).  Computerworld reports “3D printer shipments are forecast to more than double every year between 2016 and 2019” (Computerworld 9/30/2015).  More accurately described as additive manufacturing, there appears to be a manufacturing revolution in progress.

 

    The beauty of additive manufacturing is its directness, going straight from a digital file to a part.  Gone are the expenses of tooling, multiple setups, and the highly skilled individuals spending hours or weeks crafting parts.  It sounds like you’re screwing up if you’re still wasting time and money machining and molding parts.  With machines popping up in schools, libraries, street corner u-build-it shops, and many homes, everything else is obsolete!  Well… maybe not.

 

     Additive manufacturing typically builds an object in layers.  This enables the creation of hollow geometry and blind undercut features that cannot be readily manufactured by other means – think of building a ship in a bottle with the cap still on the bottle!  Some processes allow changing materials mid-stream giving multi-color or multi-hardness in a single, continuous part.

 

    “If you can make it using conventional processes, 3D printing probably isn’t going to be the best way.” 

 

     This was what I heard from an industry expert giving a seminar on additive manufacturing, the over-arching description for 3D printing, stereo lithography, fused deposition modeling, and a handful of other technical sounding process names.  The underlying message was far from discouraging; it was liberating!

 

    Some equipment manufacturers are recognizing the limitations of these processes.  Tight tolerance requirements have prompted them to offer hybrid machines that combine additive processes with precision CNC machining. (one-machine-to-rule-them-all) The tolerances achieved through traditional machining are more precise and the throughput is greater as well.

 

    When seeking to fabricate an object whose geometry can be generated by subtractive manufacturing, such as machining, with a single setup, the machining process may well be faster and more accurate. Depending on the complexity of the programming and labor involved, machining may be less expensive and multi-part runs will increase any advantage.

 

    Material properties can be a game-changer.  Additive manufacturing encompasses multiple processes, each with its own material constraints.  3D printing dispenses material in liquid form which then solidifies and sticks to the surface or layer upon which it has landed.  Material for 3D printers must be a low viscosity fluid that can be formed into tiny droplets.

    Stereo lithography (SLA) utilizes a liquid pool upon which a focused light beam polymerizes a thin layer into solid material.  It literally draws the object on the surface of the pool, lowers the new solid layer into the pool and draws the next layer on top, repeating the process over and over.  The materials for this process are very specialized.

 

    Laser sintering is similar to SLA except it starts with a powder, either spread in layers or dispensed in a stream, which gets heated and fused by a laser beam.  The fused layer is lowered and additional powder is spread on top or dispensed, providing the basis for the next solid layer.  Laser sintered materials must melt and solidify while retaining their properties.  A variety of thermoplastics and metals are used in this process, providing a broad range of capabilities. For a nice overview of the various processes, check out the Stratasys white paper 3D_MATERIALS.PDF

 

     In contrast, material options for a machined prototype are numerous.  Most metals and many polymers are available in plate, sheet, rod, and tube form. (machinable polymers) And there is one category of material that is currently not an option for the additive manufacturing processes; fiber reinforced composite polymers.  Fibers of glass, carbon, and aramid are widely used to add strength, stiffness, toughness, electrical conductivity and thermal conductivity to a wide range of polymers.  The high aspect ratio of fibers that make them so valuable as a reinforcing additive also make them incompatible with additive processes.  If the reinforced materials are pulverized or granulated small enough to use in the sintering process, the benefits of the fibers are lost.

   

   A further variation that can provide very cost-effective rapid prototyping combines the benefits of injection molding or extrusion with machining.  Injection moldable and extrusion grades of most polymers are the least expensive forms.  By creating some useful “blank” forms in high volume, and machining details into the existing geometry, machining time and material waste can be dramatically reduced.  This process is used by R H Murphy Company to produce RapidTray®  Machined Matrix Trays with lead times comparable to the additive processes.  Using molded blanks reduces the material cost by over 90% compared to stock shapes and offers the material performance that is simply unavailable from additive processes.

 

    To learn more about combining molding and machining for value and efficiency call 603-889-2255.

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RapidTray Machined Prototypes outperform 3D Printing

RAPIDTRAY® PROGRAM DELIVERS CUSTOM JEDEC MATRIX TRAYS – NO TOOLING, NO WAITING

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R.H. MURPHY RAPIDTRAY® PROGRAM DELIVERS CUSTOM JEDEC MATRIX TRAYS – NO TOOLING, NO WAITING

 

Custom manufactured JEDEC matrix trays without the cost or lead time for tooling, R.H. Murphy Company RAPIDTRAY® JEDEC outline trays provide safe, secure containment of ICs, modules, sensors, MEMS, switches, connectors – many types of electronic components.

 

RAPIDTRAY® component trays offer ESD and mechanical protection in an industry standard format.  Precision injection molding and CNC machining combine to create custom designs without custom tooling.  R.H. Murphy Company’s RAPIDTRAY® program is perfect for engineering prototypes, low and moderate volume production, and any other requirements that benefit from lead times as short as one week and a low minimum order quantity.  Options include the choice of 180°C and 60°C temperature ratings, custom part number engraving, and blank cover trays.  With several universal tray blanks available, as well as cover and spacer trays, component heights from 0.5mm to more than 25mm are readily accommodated.

The RAPIDTRAY® program is powerful for companies developing new components or working with low volume devices.  It is also ideal for equipment manufacturers seeking trays to demonstrate functionality with new products and perform customer buy off.  Production worthy and fully process capable, the RAPIDTRAY® program lets product startup proceed without prohibitive costs, lead time, or commitments.

RAPIDTRAY® JEDEC outline trays are compatible with automated and manual processes.  Premium NoStat® conductive polymers are used to ensure consistent properties and performance.  All trays are designed by engineers with extensive experience in design and manufacturing.

 

About R.H. Murphy Company

Founded in 1982, R.H. Murphy Company has been an industry leader, inventing and supplying much needed products to support manufacturing, testing, and shipment of semiconductor devices, integrated circuits, sensors, and a growing range of electronic components.  R.H. Murphy Company combines exceptional creativity with knowledge and expertise in ESD management, industry standards, and automation technology which have been applied to the design and manufacture of polymer products generating numerous U.S. and international patents.  For more information contact R.H Murphy Company, Inc., 3 Howe Dr., Amherst, NH 03031; Call 603-889-2255; Fax 603-889-3129; email [email protected]; or visit www.rhmurphy.com.

 

 

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ESD AND MECHANICAL PROTECTION FOR TEST AND BURN-IN FROM R.H. MURPHY COMPANY

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ESD AND MECHANICAL PROTECTION FOR TEST AND BURN-IN FROM R.H. MURPHY COMPANY

 

ISOPAK Test and Burn-In Carriers for semiconductor devices are unique because they provide complete ESD protection and also eliminate false test failures caused by conductive carriers.  The device leads are electrically isolated so there is no chance of carrier conductivity being mistaken as leakage during testing.  R.H. Murphy Company offers custom carriers to mate with your choice of sockets.

 

ISOPAK Carriers’ patented designs produced with standard NoStat® ESD-safe polymers provide superior performance at temperatures up to 180°C.  Their modular characteristics make them a natural platform for custom and modified carriers as well.  ISOPAK Carriers are just one of the many ways that R.H. Murphy helps preserve the value of electronic components around the globe.

 

 

About R.H. Murphy Company

Founded in 1982, R.H. Murphy Company has been an industry leader, inventing and supplying much needed products to support manufacturing, testing, and shipment of semiconductor devices, integrated circuits, sensors, and a growing range of electronic components.  R.H. Murphy Company combines exceptional creativity with knowledge and expertise in ESD management, industry standards, and automation technology which have been applied to the design and manufacture of polymer products generating numerous U.S. and international patents.  For more information contact R.H Murphy Company, Inc., 3 Howe Dr., Amherst, NH 03031; Call 603-889-2255; Fax 603-889-3129; email [email protected]; or visit www.rhmurphy.com.

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