RH Murphy Company invented “flippable” JEDEC BGA trays, ISOPAK carriers, universal JEDEC PGA trays, and has designed and manufactured thousands of different custom trays and carriers for semiconductors, ICs, micro electronics and other precision components. An approved supplier to semiconductor, aerospace, automotive, medical, and electronics manufacturers, suppliers, and users, RH Murphy is ready to help you with your component and device handling needs.

Standard tray outlines, and the JEDEC Matrix Tray outline in particular, give you instant compatibility with automation equipment, process tools, and packaging accessories used throughout the electronics industry. Waffle Pack chip trays are another commonly used tray format. RH Murphy Company has experience with these formats since they were first developed.

Bare die and CSP handling will be improved by using the most appropriate tray design for your process and application. RH Murphy’s exclusive RapidTray® program and NoStat® ESD-safe polymers are just two of the reasons to let RH Murphy Company make your trays.

Bare Die Tray & CSP Tray Features

  • Industry-standard compliance is offered – JEDEC matrix trays or 2” and 4” waffle pack trays for most applications.
  • NoStat® ESD-safe polymers are clean – no carbon powder means no sloughing and carbon contamination – and strong.
  • Bakeable and non-bake materials are available for most tray configurations.
  • Custom tray designs help with part location in the tray and precise die placement.
  • Bare-die and CSP Trays can be customized based on process needs. Special features like locating fiducials, component clearance, special material, or engraving can be specified.
  • NoStat® ESD-safe materials are static dissipating.
  • Trays can be designed for your component size and height/thickness.

Applications for Bare-Die and CSP Trays

Waffle pack chip trays have been in wide use for bare die. Packaged die have used JEDEC matrix trays for decades. Process stage and automation have often been the determining factor when choosing a tray format.

Once the dies are packaged, and need to be baked, tested, formed, prepped for mounting, or mounted, equipment compatibility has made JEDEC matrix trays the preferred format. But, while still unpackaged, bare die are often transported and stored in waffle pack trays.

Chip scale packages are often similar in geometry and size to bare die but, now ready to be mounted, should they be in waffle pack trays or JEDEC matrix trays? That depends on how they will get mounted.

Waffle packs may be a good choice if your components are very small (less than 3mm) and basically flat, part quantities are small, and the trays will be loaded and unloaded manually. If you are already working with waffle packs and are happy with waffle pack format, continuing with the format may be a good choice. If not, or if automation is a prime objective, JEDEC matrix trays may be the better choice.

Example 1

A new CSP needed a bakeable tray that could be used with conventional pick and place equipment. A new RapidTray® Machined Matrix Tray was the correct solution.

Example 2

A new CSP needed a bakeable tray that could withstand 200°C. The tray would be used in a process that was already handling 2” waffle pack trays but there was not an existing waffle pack that could handle the temperature requirement. A new custom molded waffle pack tray was the correct solution.

Example 3

A new CSP needed a tray and the package type was a small QFP with fragile formed leads. Using a conventional waffle pack tray was damaging the leads. Waffle pack trays were needed to work with the existing packaging process. But a JEDEC tray was also wanted to allow the parts to be mounted using available pick and place equipment. There were concerns about damage when transferring parts from waffle packs to JEDEC trays.

The solution was a new custom molded waffle pack tray that supported the package without damaging the leads and a JEDEC adapter tray that held 10 waffle pack trays. The pocket matrix in the waffle pack tray was sized so that, when loaded into the JEDEC outline adapter tray, the parts would be positioned in a regular matrix pattern (consistent spacing, part-to-part, in X and Y) for programming the pick and place automation.


Benefits of Using CSP Bare Die Trays

Chip scale packaging has not fully adopted JEDEC matrix trays. Companies familiar with handling other package types demand that new CSP be presented in JEDEC trays. But many prototype labs are already familiar with waffle packs and don’t want to introduce a new tray format, especially one with more than ten times the size!

Bare die have been stored in waffle pack trays since they were introduced. But new design and assembly practices that either involve mounting bare die unpackaged or that want to bring bare die into existing automation (often BGA compatible) have created the need for JEDEC outline trays for bare die.

Whichever format you choose, waffle pack, JEDEC outline, or something fully custom, RH Murphy trays give you clear benefits.

  • Precision pocket sizing protects your die or CSP.
  • Precision pocket sizing positions your parts with minimum rotation.
  • NoStat® ESD-safe polymers protect your parts from ESD damage.
  • NoStat® ESD-safe polymers are cleaner than carbon powder loaded materials.
  • Your choice of temperature ratings for your trays means you don’t pay for capability you don’t need but can have it when you do.
  • Automation compatibility improves productivity, yield, and total value.
  • Recognized tray size lets you use existing packing materials, straps, clips, tray loaders, and handling equipment.

Specifications of Bare Die Trays & CSP Trays

JEDEC matrix trays are sized and have the features described in JEDEC’s matrix tray design guide. The basic size of a JEDEC tray is 12.4”/315mm x 5.35”/135.9mm.

Waffle packs, or waffle pack trays, are not as formally defined but can be generally described as thin trays, usually 2” or 4” square.


Pricing & Availability

Bare die and CSP trays come in many forms and prices. Some of the determining factors are:

  • Quantity of trays that will be ordered – tens, hundreds, thousands
  • Tray material requirements – non-bakeable, bakeable, special materials
  • Tray configuration – JEDEC outline, waffle pack tray (2” or 4”), custom size

Generally, small order quantities have higher pricing than large quantities, non-bakeable trays are lower priced than bakeable trays, and small trays like waffle pack trays are lower priced than JEDEC trays because they use less material (but they hold fewer parts so cost per pocket may not be lower). We make trays that cost $2-$3 each, trays that are almost $50 each, and everywhere in that range. Your requirements and budget will be factored into our recommended solution.

NRE charges will range from zero (existing designs with no tooling requirements) to $50k or more for new, custom molded, high-temp bakeable JEDEC trays.

All trays will be custom manufactured per your order. Lead times usually range from 2 weeks to 6 weeks. New designs that require new mold construction usually have a lead time of 4 to 10 weeks for initial samples, prior to starting production.


Request a Quote

Your next step is to tell us about your needs so we can build the correct tray for your application. A drawing, model or sample of your part and a few simple details are all we need to connect you with your custom bare die or CSP tray.

Here is the information we will use to determine your best tray option and generate your quotation.

  • Sample, CAD model, or drawing of the die or package with accurate dimensions (± .005”/0.13mm)
  • Preferred tray format – JEDEC outline, 2” or 4” waffle pack, something else
  • Quantity of parts for which you will need trays, now and overall, and anticipated ordering quantities
  • Timeline for your tray requirements
  • Temperature requirements – Do you need bakeable trays (rated up to 180°C) or non-bakeable (rated up to 60°C) or another temp
  • How tray will be used – shipping, storage, processing, automated or manual handling
  • Any special requirements for your process

Call us, send an email, or click here to receive your quote.


Frequently Asked Questions

Are there standard trays?

Most trays are part specific with pockets designed for a particular sized part. It is not uncommon to try to use an open-tooled tray designed for a larger part but there are notable risks doing so.

Off the shelf trays are trays designed for a specific part but sold with enough frequency that a manufacturer or distributor maintains some inventory.

Can the same tray be used for different sized parts?

If tray pockets are not the correct size, parts that are too big can be lost or damaged. Parts that are too small will move around in the pockets. Too much clearance can allow part damage. Excess clearance can also cause problems with automated pickup and placement. Clearance may be acceptable if trays will only be used in a manual process and are not being used for shipping.

Parts that differ only in thickness/height may share trays designed for the thickest/tallest version. Too much extra pocket depth can allow damage during shipping or may make part removal difficult.

What colors are available?

RH Murphy trays are usually blue, if non-bakeable, or black if rated for higher temperatures. Other colors are possible for non-bakeable trays on a special-order basis. Colors other than black are not readily available for bakeable trays because of the difficulty making pigment that can withstand the manufacturing process.

Where are the trays made?

RH Murphy Company currently manufactures all trays in the U.S.A.

Are trays cleanroom compatible?

RH Murphy trays are usually considered clean room compatible. Special packaging may be required depending on individual customer requirements.

What is the minimum order quantity?

RapidTray® Machined Matrix Trays for bare die and chip scale packages have minimum order quantity (MOQ) or 5 trays. New custom molded bare-die and chip-scale package trays have no formal MOQ but NRE charges for new trays make 250 or 500 a practical lower limit.

Are sample trays available?

Because most trays will be custom manufactured to order, sample trays are not usually available. If we have an existing design of a custom molded tray that is appropriate, and have any inventory, a sample may be possible. With RapidTray® Machined Matrix Trays, the low MOQ makes ordering a small quantity for evaluation very practical.


Do You Need Covers?

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