IC Matrix Trays provide protection and precise positioning of components in an automated environment. By positioning components in a well defined pattern, they simplify automation and associated programming tasks. IC trays are specifically designed to protect device leads from damage and to prevent ESD damage. Most IC Matrix Trays conform to the JEDEC Matrix Tray outline that is widely used for semiconductors and other types of electronic components as well as optical and photonic products, and purely mechanical parts. ESD protection, pick and place automation, and utilization of standardized process equipment are the most common reasons companies choose to use IC Matrix Trays.
Applications of IC Matrix Trays
- Protection – IC matrix trays provide electrical protection from electrostatic discharge (ESD) damage. They also protect the parts they hold from mechanical damage.
- Automation – IC matrix trays offer compatibility with most semiconductor and PC board manufacturing equipment. With decades of history and familiarity, support products for IC matrix trays is widespread and global. This includes assembly, test, moisture bake, inspection, and pick-and-place processing.
- Transportation & Storage – parts loaded into stacked IC matrix trays are easy to store or transport, across the room or around the world. Matrix trays also function as process “boats”, precisely moving parts through a variety of processes and operations.
- Standardization – When conforming to the JEDEC matrix tray outline, IC trays offer compatibility with most semiconductor and PC board manufacturing equipment. With decades of history and familiarity, support products for JEDEC matrix trays are widespread and global. This includes corrugated boxes, protective covers, retaining straps, modular feeders, and a wealth of industry knowledge. Many different custom products can run on the same lines, across multiple sites, or multiple manufacturers due to the common handling platform provided by JEDEC IC matrix trays.
Benefits of Using IC Matrix Trays
IC matrix trays are recognized and understood. They give you instant access to equipment and accessories. JEDEC outlines have become the common language of automation.
Four simple values define the matrix of tray pockets: X and Y position of the “first” pocket, and X and Y steps for all additional rows and columns. Included features ensure proper orientation. They work well with many types of elevator and feed mechanisms. Interlocking features keep tray stacks stable.
Precision Built In
IC matrix trays have well established reference features and datums. The outline dimensions and tolerances take the risk out of equipment design, accelerating development time and lowering cost.
Convenient and Practical
Pin One indicators, visual alignment indicators, and designated space for marking and engraving – years of development make IC matrix trays a smart, practical tool for your manufacturing process.
Adaptable and Process Compatible
IC matrix trays can be designed for almost any components. Material options offer ESD protection, temperature and chemical compatibility, and a wide range of properties to match your application.
WIP, Ship, and Storage
It’s easy to get one tray for all your needs. Build your parts, hold them on the shelf or ship them out, and then move them into final system assembly. No extra handling. No extra containers or media. Available boxes, straps, and bags make it simple!
Our IC Matrix Tray Solutions
With IC matrix trays, the details of the pockets, the matrix, are what make them custom and valuable. Our experience gained making matrix trays for thousands of different parts has made us experts. Here are some examples of the benefits of, and needs for, custom IC matrix trays.
- BGA trays benefit from being flippable. Once it was realized the BGA solder balls needed to be inspected, flippable BGA trays became the gold standard.
- PGA packages have arrays of strong pins that can tolerate use as locating features. Universal PGA matrix trays that can hold a variety of sizes are unique among IC trays.
- QFP trays, and trays for other gull wing surface mount packages, place an emphasis on protecting the leads from damage. Most matrix trays for these packages have elevated pedestals and “fences” that fit inside the formed leads to capture and locate the package body. The leads remain clear of contact with the tray.
- TQFP, TSOP, SOIC and similar packages have lead forms that do not offer enough clearance for molded “fences”. Matrix trays for these packages often make contact with the leads to locate the parts in the trays. The leads are short enough that they can usually withstand the contact without damage, helped by the packages often being very low mass. Some custom molded trays for these package types will have features on the trays’ undersides that provide secondary retention for parts below when trays get stacked.
Specifications of IC Matrix Trays
In general, most IC matrix trays look similar and have a standard outline but they are custom designed and manufactured. Many of them are not only device specific but device manufacturer specific.
Off-the-shelf simply means a manufacturer has enough demand for a specific custom tray that they carry some inventory. More common is open-tooled where a custom mold will be set up and run for any order but often with a minimum quantity and/or significant setup charges.
IC Matrix Trays usually conform to the JEDEC Matrix Tray Outline in JEDEC Publication 95 with nominal length of 315mm (12.4”) and width of 135.9mm (5.35”). There are two thickness defined by JEDEC but many other variations dictated by the size of the parts for which the trays have been designed. Tray flatness tolerance is specified to be within 0.8mm (.030”).
There’s a reason they are called “matrix” trays. Parts are retained in the trays in regular patterns of rows and columns, creating an array, or matrix. The number of rows and columns (the order of the matrix), the position of a corner point of the pattern, and the pitch of the rows and columns fully defines the matrix including the number pockets and the location of each pocket within the tray. Automation equipment that uses IC matrix trays accepts these input parameters for simplified programming.
RH Murphy Co. manufactures most of our IC matrix trays of one of our NoStat® ESD-safe polymers but also uses a variety of custom materials based on application requirements.
The maximum number of parts a tray can hold depends on the part geometry, the application’s processing requirement (how parts will be loaded and removed, special tray features, etc.), and the tray manufacturing limitations.
Many IC matrix trays rely on the use of carbon to make the material conductive for ESD protection. This results in a default tray color of black. Other colors are possible depending on the material properties.
RH Murphy Co. traditionally uses blue materials to identify trays that are not bakeable, i.e. have maximum continuous use temperature ratings below 100℃.
Our Expertise in IC Matrix Trays
RH Murphy Co. has been designing and manufacturing IC matrix trays for many years. We were one of the first manufacturers of JEDEC matrix trays and we have been designing and producing them continuously since then.
We understand what makes for a great tray and we also know how to get the full value from IC matrix trays. Our NoStat® ESD-safe polymers have been formulated specifically to meet the needs of tray manufacturing.
Our customers have access to knowledge gleaned from thousands of applications and projects. You can have the benefits of:
- Years of experience in providing matrix tray solutions
- Knowledge and understanding of matrix tray standards and requirements
- State-of-the-art equipment and technology for matrix tray production
- Highly trained and knowledgeable team of professionals
IC Matrix Tray Accessories
- For most IC matrix trays, which conform to the JEDEC outline, we offer JEDEC Matrix Tray Covers – RHM-930 covers which protect the trays that they cover. These tray covers help keep trays and parts clean, prevent accidental handling contact with parts, and give extra ESD protection.
- Tray Straps – Our experience has been that ESD-safe hook and loop straps are the most popular reusable retaining method. Some companies use thermally bonded plastic straps but they require special tools to apply and have to be cut off. We do not sell the straps but a web search on “Velcro straps” or “ESD Velcro Straps” might get you other options.
- Tray packaging – boxes and bags – are less standardized because the number of trays and stack sizes vary. But most suppliers have options that work well. Be sure to tell your supplier the dimensions and weight of your tray stacks so they can get you the correct size and strength materials.
Pricing & Availability
- Custom Molded IC Matrix Trays – generally $3 to $15 – higher quantities have lower prices, less than 1,000 the price rises sharply – non-bakeable trays have lower prices than bakeable trays – the NRE Charge associated with a new tray mold ranges from $20k to $45k.
- Trays that are in stock ship within one to two business days.
- Trays that are tooled but not in stock usually ship within four weeks.
- New custom molded matrix trays, requiring a new mold, generally ship in six to sixteen weeks for the date of order, depending on the type of tooling being built and the amount of time the customer needs to evaluate first article samples.
- RapidTray® Machined IC Matrix Trays – $22 to $50 each – no tooling is required – $225 programming charge on first order only – fixed prices from 10 to 1,000. Standard lead time is two weeks after receipt of order. RapidTray® Machined IC Matrix Trays all follow the JEDEC Matrix Tray outline.
Request a Quote
IC Matrix Trays are the best way to package and handle many types of components. Your next step is to tell us about your needs so we can build the correct tray for your application. A drawing, model or sample of your part and a few simple details are all we need to connect you with your custom JEDEC matrix tray.
Here is the information we will use to determine your best tray option and generate your quotation.
- Sample, CAD model, or drawing of the module or part with accurate dimensions (± .005”/0.13mm)
- Quantity of parts for which you will need trays, now and overall, and anticipated ordering quantities
- Timeline for your tray requirements
- Temperature requirements – Do you need bakeable trays (rated up to 180°C) or non-bakeable (rated up to 60°C) or another tem
- How tray will be used – shipping, storage, processing, automated or manual handling
- Any special requirements for your process
Call us, send an email, or click here to receive your quote.