Simple solutions to complex problems.
From the leaders in JEDEC tray, component handling and protection.
Our ProductsWe understand—you’ve got to protect your parts.
Welcome to RH Murphy Company, inventor of flippable BGA trays, ISOPAK chip carriers, and many other problem-solving products. Our experience with high performance plastics engineering, JEDEC tray, matrix tray, ESD management, electronics handling and packaging, and flexible manufacturing gives us the knowledge and tools to give you what you need with quality and value. Exceptional performance and outstanding value—a winning combination. Let our experience work for you.
Request a QuoteWe speak JEDEC trays.
Many of our products incorporate JEDEC standard elements that ensure compatibility with industry standard products, equipment, and processes. We also provide custom features that are application specific. Whether prototype, low volume production, or high volume series production, we offer solutions optimized for demand.
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FYI Post
Why Use Waffle Pack Trays?
Waffle pack chip trays are popular for handling, storing, and transporting small, 2.5D (flat with some thickness but no significant contour) components in a manual process. While there are automated systems to move waffle packs, the trays themselves lack features to facilitate automation.